After purchasing parts for the prototype, began construction on the device and finished quickly. Soldered Radiator Fan, Cooling Fan, and Pump together as they all have non-variable voltage/current draw. Left Peltier separate in order to test various voltage values across the chip. Began initial testing of cooling capabilities using a Styrofoam container as the vessel to be cooled. Initial findings show temperature drops in the container to vary based on both time unit is running and voltage applied to the peltier. Based on these initial tests, it is clear that a better fan will be needed for the cooling side of the heat exchange device. The small internal fan does not provide sufficient air flow for proper heat transfer in its current state. Although the dT/dt is anywhere from 18 F to 26 F currently, this can be improved by increasing the circulation of air. Similarly, the pump system could be improved by increasing the volume of water and by increasing the rate at which fluid is pumped to allow for greater heat exchange at higher peltier temperatures.
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